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Apple Chief Executive Signals Upcoming Price Hikes Across Product Lineup

19 Jun. 10:21

Source

Apple CEO Tim Cook has announced that the company's hardware products are expected to face price increases due to the rising costs of memory chips and storage components. In a recent media statement, the executive noted that the upward trend in manufacturing expenses has become unavoidable, forcing the tech giant to adjust its global retail pricing strategies despite attempts to shield consumers from market volatility.

Financial simulations provided by the research firm TechInsights indicate that if the total increase in component costs is transferred directly to end-users, the retail price for the upcoming high-end iPhone Pro models could see a substantial premium of approximately 270 USD. Currently, the multinational corporation has chosen not to reveal the exact list of specific electronic devices affected or the precise timeline for the scheduled pricing adjustments.

The underlying cause for the market shifts is the rapid expansion of artificial intelligence infrastructure, which has generated unprecedented global demand for high-performance DRAM memory modules. Cook stressed that achieving equilibrium in the supply and demand chains for consumer-grade semiconductor technologies remains an urgent priority for the sector. While Apple plans to utilize its financial capital to diversify component procurement sources, it will not establish in-house manufacturing lines for silicon microchips.

These institutional decisions coincide with a major corporate transition, as Cook is scheduled to step down from his role as CEO on September 1, 2026. John Ternus is set to take over the operational management of the technology firm, while Cook will transition into the position of Executive Chairman to oversee long-term corporate governance.

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On-the-Go Power: Japanese Engineers Develop Wireless In-Road Charging for Electric Vehicles

10 Oct. 08:10

Source

In a major leap for electric mobility, Honda R&D, alongside Taisei Corporation and Taisei Rotec, has unveiled an innovative dynamic wireless charging system that charges electric vehicles as they drive. By embedding compact energy-transmitting modules directly into the road surface, the system transfers power via a magnetic field to receivers mounted underneath moving vehicles. Designed to withstand heavy commercial transport up to 20 tons, real-world road testing is scheduled to begin in Japan in April 2027.

The technology eliminates the need for full road reconstruction, as modules can be integrated directly into milled asphalt layers. Aimed at boosting charging power up to 150 kW in future iterations, this infrastructure solution promise to significantly reduce grid pressure on traditional charging stations, particularly for logistics and commercial fleets.

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